Intel® NUC Kit NUC6i7KYK

Intel® NUC Kit NUC6i7KYK

Essentials

Product Collection
Intel® NUC Kit with 6th Generation Intel® Core™ Processors
Code Name
Products formerly Skull Canyon
Processor Included
Intel® Core™ i7-6770HQ Processor (6M Cache, up to 3.50 GHz)
Board Number
NUC6i7KYB
Supported Operating Systems
Windows 10, 64-bit*, Windows 8.1, 64-bit*, Windows 7, 64-bit*, Windows Server 2012 R2*, Windows Server 2012*
New Design Availability Expiration Date
Tuesday, March 16, 2021
Recommended Customer Price
$618.94

Supplemental Information

Marketing Status
Discontinued
Launch Date
Q2'16
Warranty Period
3 yrs
Embedded Options Available
No
Datasheet
View now
Description
Other features: Includes Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2 via USB-C; also includes SDXC card slot
Additional Information
View now

CPU Specifications

Total Cores
4
Total Threads
8
Max Turbo Frequency
3.50 GHz
Processor Base Frequency
2.60 GHz

Memory & Storage

Max Memory Size (dependent on memory type)
32 GB
# of Memory Slots
2
Memory Types
DDR4-2133+ 1.2V, 1.35V SO-DIMM
Max # of Memory Channels
2
Max Memory Bandwidth
34.1 GB/s
ECC Memory Supported ‡
No
Internal Drive Form Factor
M.2 SSD
# of Internal Drives Supported
2
Removable Memory Card Slot
SDXC with UHS-I support
M.2 Card Slot (storage)
2x 22x42/80

I/O Specifications

Graphics Output
Mini-DP 1.2; HDMI 2.0; USB-C (DP1.2)
# of Displays Supported ‡
3
# of Thunderbolt™ Ports
1x Thunderbolt™ 3
# of USB Ports
9
USB Configuration
2x front and 2x rear USB 3.0, 1x USB 3.1 via Thunderbolt 3; 2x USB 2.0, 2x USB 3.0 via headers
USB Revision
2.0, 3.0, 3.1 Gen2
USB 2.0 Configuration (External + Internal)
0 + 2
USB 3.0 Configuration (External + Internal)
2F, 2R, 2i
Total # of SATA Ports
2
Max # of SATA 6.0 Gb/s Ports
2
RAID Configuration
(2x M.2 SATA or 2x M.2 PCIe) SSD (RAID-0 RAID-1)
Audio (back channel + front channel)
7.1 digital; L+R+mic (F); L+R+TOSLINK (R)
S/PDIF Out Connector
TOSLINK
Integrated LAN
Intel® Ethernet Connection I219-LM
Wireless Included
Intel® Dual Band Wireless-AC 8260
Bluetooth Version
4.2
Consumer Infrared Rx Sensor
Yes
Additional Headers
CEC, 2x USB2.0, 2x USB 3.0, FRONT_PANEL

Expansion Options

PCI Express Revision
Gen3
PCI Express Configurations ‡
Dual M.2 slots with PCIe x4 lanes

Package Specifications

TDP
45 W
DC Input Voltage Supported
19 VDC
Chassis Dimensions
211 x 116 x 28 mm
Board Form Factor
UCFF (4" x 5")

Advanced Technologies

Intel® HD Audio Technology
Yes
Intel® Rapid Storage Technology
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes

Security & Reliability

Intel® Platform Trust Technology (Intel® PTT)
Yes
TPM
No
Intel® AES New Instructions
Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

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