Product Collection
Marketing Status
Launched
Launch Date
2011
Lithography
28 nm

Resources

Logic Elements (LE)
190000
Adaptive Logic Modules (ALM)
71698
Adaptive Logic Module (ALM) Registers
286792
Fabric and I/O Phase-Locked Loops (PLLs)
12
Maximum Embedded Memory
12.973 Mb
Digital Signal Processing (DSP) Blocks
600
Digital Signal Processing (DSP) Format
Variable Precision
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR II+, DDR2, DDR3, LPDDR, LPDDR2, QDR II, QDR II+, RLDRAM II, RLDRAM 3

I/O Specifications

Maximum User I/O Count
544
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
256
Maximum Non-Return to Zero (NRZ) Transceivers
24
Maximum Non-Return to Zero (NRZ) Data Rate
6.5536 Gbps
Transceiver Protocol Hard IP
PCIe Gen2

Advanced Technologies

FPGA Bitstream Security
Yes
Analog-to-Digital Converter
No

Package Specifications

Package Options
F672, F896, F1152

Supplemental Information