Compare Now

Technical Specifications

Essentials

Capacity
1.2 TB
Status
Launched
Launch Date
Q3'16
Lithography Type
3D NAND G1 MLC

Performance

Sequential Read (up to)
1700 MB/s
Sequential Write (up to)
1300 MB/s
Random Read (100% Span)
320000 IOPS
Random Write (100% Span)
26000 IOPS
Latency - Read
110 µs
Latency - Write
50 µs
Power - Active
Avg. 11W (Write), 9W (Read)
Power - Idle
4W

Reliability

Vibration - Operating
2.17 GRMS
Vibration - Non-Operating
3.13 GRMS
Shock (Operating and Non-Operating)
1000 G/0.5msec
Operating Temperature Range
0°C to 35°C
Endurance Rating (Lifetime Writes)
1480 TBW
Mean Time Between Failures (MTBF)
2 million hours
Uncorrectable Bit Error Rate (UBER)
1 sector per 10^17 bits read
Warranty Period
5 yrs

Package Specifications

Weight
Up to 125gm
Form Factor
2.5" 15mm
Interface
PCIe NVMe 3.0 x4

Advanced Technologies

Enhanced Power Loss Data Protection
Yes
Hardware Encryption
AES 256 bit
High Endurance Technology (HET)
No
Temperature Monitoring and Logging
Yes
End-to-End Data Protection
Yes

Reviews

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.