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Technical Specifications

Essentials

Capacity
1 TB
Status
Launched
Launch Date
Q2'18
Lithography Type
64-Layer 3D TLC NAND
Use Conditions
Server/Enterprise

Performance

Sequential Read (up to)
1950 MB/s
Sequential Write (up to)
1000 MB/s
Random Read (100% Span)
295000 IOPS
Random Write (100% Span)
31000 IOPS
Latency - Read
85 µs
Latency - Write
40 µs
Power - Active
7.6W
Power - Idle
3.5W

Reliability

Vibration - Operating
2.17 GRMS (5-700 Hz)
Vibration - Non-Operating
3.13 GRMS (5-800 Hz)
Shock (Operating and Non-Operating)
1000G (0.5ms)
Operating Temperature Range
0°C to 55°C
Endurance Rating (Lifetime Writes)
Up to 0.98PBW
Mean Time Between Failures (MTBF)
2 million hours
Uncorrectable Bit Error Rate (UBER)
1 sector per 10^-17 bit reads
Warranty Period
5 yrs

Package Specifications

Weight
14g
Form Factor
M.2 22 x 110mm
Interface
PCIe NVMe 3.1 x4

Advanced Technologies

Enhanced Power Loss Data Protection
Yes
Hardware Encryption
AES 256 bit
High Endurance Technology (HET)
No
Temperature Monitoring and Logging
Yes
End-to-End Data Protection
Yes
Intel® Smart Response Technology
No
Intel® Remote Secure Erase
No
Intel® Rapid Start Technology
No

Reviews

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.