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Technical Specifications

Essentials

Capacity
256 GB
Status
Launched
Launch Date
Q3'18
Lithography Type
64-Layer 3D TLC NAND
Use Conditions
Server/Enterprise

Performance

Sequential Read (up to)
2200 MB/s
Sequential Write (up to)
280 MB/s
Random Read (100% Span)
125000 IOPS
Random Write (100% Span)
5700 IOPS
Power - Active
4.0W
Power - Idle
0.7W

Reliability

Vibration - Operating
2.17GRMS
Vibration - Non-Operating
3.13GRMS
Shock (Operating and Non-Operating)
1000 G/0.5 ms
Operating Temperature Range
0°C to 70°C
Mean Time Between Failures (MTBF)
1.6 million hours
Uncorrectable Bit Error Rate (UBER)
<1 sector per 10^15 bit read
Warranty Period
5 yrs

Package Specifications

Weight
<10g
Form Factor
M.2 22 x 80mm
Interface
PCIe NVMe 3.1 x4

Advanced Technologies

Enhanced Power Loss Data Protection
No
Hardware Encryption
AES 256 bit
High Endurance Technology (HET)
No
Temperature Monitoring and Logging
No
End-to-End Data Protection
No
Intel® Smart Response Technology
No
Intel® Remote Secure Erase
No
Intel® Rapid Start Technology
No

Reviews

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.