Single-SKU Global Coverage. Gigabit+ Speeds. 14nm for Slim, Powerful Designs.
The Intel® XMM™ 7660 modem is Intel’s sixth generation LTE modem and it demonstrates our commitment to deliver leading-edge cellular technology that exceeds gigabit downlink speeds, provides low latency, as well as RF innovations which allow customers to build world-wide radios in a single SKU. The modem, which is designed via 14nm manufacturing process, delivers high-speed LTE-advanced connectivity for quality voice calls and data-intensive applications, including video streaming, multi-player gaming, virtual reality applications and more.
The Intel® XMM™ 7660 modem meets the Release 14 specification from 3GPP (3rd Generation Partnership Project). It is blazing fast — supporting speeds up to 1.6Gbps in the downlink (Cat 19), and up to 150 Mbps in the uplink. Beyond LTE, it offers support for LTE/LTE DSDS (dual SIM, dual standby), which allow the XMM7660 modem to be roaming on two different LTE networks at the same time — without duplicating modem hardware. It also supports LAA (Licensed Assisted Access) as well as CBRS (Citizen Broadband Radio Service) shared spectrum to enhance flexibility and throughput options. The modem’s architecture is optimized to provide these services, while also ensuring in-device coexistence.
This modem was designed with the global manufacturer in mind. Not only does it support six modes of operation, it also provides 7x Carrier Aggregation for downlink of five non-contiguous bands up to 140MHz as well as integrating 4 mode GNSS with GPS, Galileo, GLONASS, and BeiDou positioning systems for worldwide satellite navigation support.
The XMM 7660 transceiver offers world-class band density—supporting more than 45 bands with a very large number of Carrier Aggregation combinations simultaneously in a single SKU for true global mobile coverage. It is a competitive solution for device manufacturers looking to quickly design and launch LTE devices in multiple market segments and geographies worldwide, and a strong addition to Intel’s broad portfolio of connectivity solutions.