Built with Purpose, Designed for Performance.

Key Benefits

  • Consolidate and accelerate warm storage.

  • Enable 1PB of storage in just 1U.

BUILT IN - ARTICLE INTRO SECOND COMPONENT

Break free from the limitations of legacy data center SSD form factors with the revolutionary new E1.L and E1.S Intel® SSDs based on Enterprise and Data Center SSD Form Factor (EDSFF). Designed from the ground up, EDSFF-based SSDs deliver the building blocks for scalable solutions. Increased operational efficiency and massive space consolidation reducing the storage physical footprint, results in lower TCO. Featuring a common connector and pinout, the array of flexible, future-ready features enable a broad range of interoperable designs.

Designed to Meet Top Data Center Storage Challenges

Creation of EDSFF was guided by three principles: enable scale, optimize total cost of ownership, and enable dynamic range of solutions.

These principles were driven by key data center storage challenges, as surveyed from top IT decision makers, including: ability to scale capacity to support data and application growth, driving down the cost of storage—lowering operating and capital expenditures, while increasing storage agility, and deliver required application performance without compromises. With a healthy and growing ecosystem, Intel supports EDSFF as the data center form factor standard of the future.

Now You Have Options

The E1.L and E1.S give you options for a variety of data center needs.

E1.L is a form factor optimized for disaggregated systems. Providing high per server capacity, E1.L enables up to 32 drives per rack unit for massive storage power. In addition to capacity, this form factor provides key features of thermal efficiency, full serviceability, scalability, and future ready performance.

E1.S provides the best of U.2 and M.2.—a scalable, flexible, power, and thermally efficient SSD building block. This form factor was designed for high-volume hyperscale, and allows system flexibility, increased storage density, modular scaling, improved serviceability, and more efficient cooling optimized for 1U servers.

Notices & Disclaimers

Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure.

Your costs and results may vary.

Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.

Intel technologies may require enabled hardware, software, or service activation.

Product and Performance Information

1

Source- Intel. 983TB total using 32 30.72TB SSDs; 32 SSDs per 1U node using E1.L form factor. Based on 30.72TB Intel® SSD D5-P4326 available at a future date.

2

Source – Intel. Comparing airflow required to maintain equivalent temperature of a 4TB U.2 15mm Intel® SSD DC P4500 to a 4TB EDSFF-based form factor for Intel® SSD DC P4500. Results have been estimated or simulated using internal analysis or architecture simulation or modeling, and provided for informational purposes. Simulation involves three drives for each form factor in a sheet metal representation of a server, 12.5mm pitch for the EDSFF-based form factor, 1000m elevation, limiting SSD on case temp of 70°C or thermal throttling performance, whichever comes first. 5°C guard band. Results used as a proxy for airflow anticipated on EDSFF spec compliant form factor Intel® SSD P4510.

3

Source – Intel. Comparing airflow required to maintain equivalent temperature of an 8TB U.2 7mm Intel® SSD DC P4500 to a 8TB EDSFF E1.S form factor for Intel® SSD DC P4510. Results have been estimated or simulated using internal analysis or architecture simulation or modeling, and provided for informational purposes. Simulation involves comparing the 1U server implementations of each form factor. E1.S is vertically oriented at an 11mm pitch, and the U.2 7mm is horizontally oriented at an 18mm pitch. Both form factors are surrounded in a sheet metal representation of a server. Each form factor is limited by condition to initiate thermal throttling.