Intel® Communications Chipset 89xx Series: Design Guide

Intel® Communications Chipset 89xx Series: Design Guide

Intel® Communications Chipset 89xx Series: Design Guide

Power dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.

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