Heterogeneous 3D system-in-package integration.
Heterogeneous 3D System-in-Package Integration
Multi-Die Integration with EMIB
- Higher Performance / Bandwidth
SiP integration with AIB and EMIB, enable the highest interconnect density between chiplets. This results in high bandwidth connectivity between the SiP components. In addition, user signals communicating to the external world use standard FCBGA traces, thereby improving signal and power integrity.
- Low Power
Companion chiplets are placed close to each other so the interconnect traces are very short. This enables a low power/bit.
- Small Form Factor
The ability to heterogeneously integrate components in a single package results in small form factors. This helps customers save valuable board space, reduce board layers, and decrease the bill of material (BOM) cost.
- Greater Flexibility, Scalability, and Ease of Use
SiP reduces routing complexity at the PCB level because the components are already in the package. In addition, SiP enhances the ability to incorporate different die geometries in silicon technologies. The net result is a highly flexible, scalable solution that is easy to use.
- Faster Time to Market
SiP enables faster time to market by being able to integrate already proven technology and reuse common devices or tiles across product variants. This saves valuable time and resources, thereby helping customers accelerate their time to market.
Learn More About Heterogeneous 3D SiP Integration
Download this white paper to learn more about how Intel® Stratix® 10 FPGAs and SoCs leverage heterogeneous 3D SiP integration to deliver performance, power, and form factor breakthroughs while providing greater scalability and flexibility. In addition, learn how Intel Embedded Multi-die Interconnect Bridge (EMIB) technology delivers a superior solution for multi-die integration.