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Intel® Communications Chipset 89xx Series AMC Reference Design Kit

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Intel® Communications Chipset 89xx Series: Design Guide

Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)

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Intel® Xeon® Processor E5-2600 v2 Series: Power Guidelines

Guidelines: Provides power data for the Intel® Xeon® processor E5-2600 v2 series while running real-life applications. (v.1, Aug. 2013)

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Basics of Building Intel® Architecture Design

White Paper: Describes elements of Intel® architecture design, including voltage regulators, clock sources, and power sequencing. (v.1, Sept. 2010)

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Multi-Core Processor Performance Optimization

Sarma Vrudhula of Arizona State University presents research on multi-core processor performance optimization under thermal constraints.

BOM Cost Reduction: Remove Intel® Atom™ Processor E6xx S3 State

White Paper: Intel® Atom™ processor E6xx power state overview shows Bill of Materials (BOM) cost reduction by removing S3 state. (v.001, May 2011)

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Intel® 4 Series Chipset: Thermal/Mechanical Design Guide

Thermal and Mechanical Design Guide: Intel® 4 Series Chipset Family.

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Intel® I/O Controller Hub 10 Family: Thermal Design Guide

Intel® I/O Controller Hub 10 (ICH10) Family.

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