Describes the signal description, system address map, MCH register description, DRAM controller registers, primary and secondary bridge registers, electrical characteristics and ballout, and package information for the Intel® 3200 and 3210 chipsets.
Combines the performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. These processors are 64-bit processors that maintain compatibility with IA-32 software.
Dual-core Intel® Xeon® processor 3000 series-based server platforms are ideal for building cost-sensitive yet powerful HPC clusters.
Economical high-performance computing platforms with outstanding reliability and value.
Datasheet: Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH).
The Intel® 3010 chipset is designed for use with Intel® Pentium® 4 processor 600 Sequence, Intel® Pentium® D processor 800 Sequence and 900 Sequence, Intel® Celeron® D, and Dual-Core Intel® Xeon® Processor 3000 Series in the LGA775 package.
Thermal and mechanical operating limits, specifications, and reference thermal solution for Intel® 3000 and 3010 chipsets memory controller hub (MCH).
This document outlines the thermal and mechanical operating limits and specifications for the Intel® 3000 and 3010 chipsets memory controller hub (MCH) and describes a reference thermal solution that meets their specification.
Specification Update, 2008: Intel® 3000 and 3010 chipset memory controller hub (MCH), clarifications, changes, and documentation errata.
Specification updates for the Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH), including device and documentation errata, specification clarification, and changes.
Datasheet: provides thermal specifications and guidelines for systems using Intel® Xeon® processor 3000 series.
Provides thermal specs, guidelines for systems using Intel® Xeon® processor 3000 series.