With the Intel® 5000V chipset for the Intel® Xeon® processor 5000 series can enable a system designer to offer faster time-to-solution.
With the Intel® 5000V Chipset and Intel® Xeon® processor 5000 series, system designers can offer faster time-to-solution.
Specification Update, 2009: Intel® 5000 series chipset Memory Controller Hub (MCH), clarifications, changes, and documentation errata.
Specification updates for the Intel® 5000 Series Chipset Memory Controller Hub (MCH), including device and documentation errata, specification clarification, and changes.
Datasheet: Intel® 631xESB/ 632xESB I/O Controller Hub covers signal and functional descriptions, mechanical specifications, registers, and more.
This specification is intended for Original Equipment Manufacturers designing and building Intel® 631xESB/632xESB I/O Controller Hub-based products.
Thermal and Mechanical Design Guide: Intel® 631xESB and 632xESB I/O Controller Hub.
Discusses packaging technology, thermal specification, metrology, and solution for the Intel® 631xESB and 632xESB I/O Controller Hub.
This document is a core specification for a Fully Buffered DIMM (FB DIMM, also FBD) memory system. Information critical to an Intel® 6400/6402 Advanced Memory Buffer (AMB) design appears in the other specifications, with specific cross-references.
Specification Update: Intel® 6400/6402 Advanced Memory Buffer covers document changes, errata, specification changes, and clarifications.
This document is a compilation of device and document errata and specification clarifications and changes, and is intended for hardware system manufacturers and for software developers of applications, operating systems, and tools.
Thermal and Mechanical Design Guide: Intel® 5000 Series Chipset Memory Controller Hub.
Discusses packaging technology, thermal specification, metrology, and solution for the Intel® 5000 series Chipset Memory Controller Hub.