• <More on Intel.com

Intel® 3100 Chipset Intel® Xeon® and Celeron® Processors: Brief

We are sorry, This PDF is available in download format only

Intel® 3100 Chipset for Intel® Xeon® and Celeron® Processor: Brief

Product Overview
The Intel® 3100 chipset combines server-class memory and I/O controller functions into a single component, creating the first integrated Intel® chipset specifically optimized for embedded, communications, and storage applications. This single-chip system controller replaces a separate memory controller hub and I/O controller hub, significantly conserving board real estate and power consumption.

The 667 MHz front-side bus (FSB) supports Intel® Xeon® processors LV and ULV and the Celeron® processors 1.66 GHz and 1.83 GHz addressing the needs of high-performance, low-power platforms within small form factor designs such as PrAMC, Compact PCI* and COM Express.* The Intel Xeon processor LV has a thermal design power (TDP) of 31W; the ULV version has a TDP of 15W; and the Celeron processor has a TDP of 27W.

Intel Xeon processors LV and ULV combine the benefits of dual-core processing capability and intelligent power management for improved performance/watt, while the Celeron processors provide value in a single-core solution. These processors support FSB parity and Intel® Virtualization Technology, making them ideal for a wide range of high-performance applications with restricted power requirements.

Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance, Intel helps cost-effectively meet development challenges and speed time-to-market.

Read the full Intel® 3100 Chipset for Intel® Xeon® and Celeron® Processor Product Brief.