The Intel® E8500 chipset a high performance, scalable platform offered in the 64-bit Intel® Xeon® processor family. Intel's sixth-generation four-way MP platform is architected for dual-core CPUs, and it is compatible with Intel's single-core processors, giving it an enhanced lifespan and helping to lower Total Cost of Ownership (TCO).
In addition, the Intel® E8500 chipset offers enhanced performance, increased bandwidth, and greater flexibility, manageability, and I/O integration than Intel's previous generation MP chipsets. Plus, it is available in a variety of configurations suitable for a wide range of price points and application environments.
|Features and benefits|
|Architected for dual-core CPUs and compatible with Intel's current single-core processors.||Enhanced lifespan and helps to lower Total Cost of Ownership (TCO).|
|DDR-266, DDR-333 or DDR2-400||DDR-266, DDR-333 or DDR2-400 memory-based subsystems offer reduced latency while consuming less power than previous generations.|
|Up to 8 MB cache||Up to 8 MB cache from 64-bit Intel® Xeon® processors MP for fast response times.|
|Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology||Gives you the advantage of power savings and increased system density for server applications and helps improve workstation acoustics.|
|Intel® Extended Memory 64 Technology (Intel® EM64T)||Extends flat memory addressability beyond 4 GB.|
|Intel® Streaming SIMD Extensions 3 (Intel® SSE 3)||Includes thirteen additional SIMD instructions over SSE2. The new instructions are primarily designed to improve thread synchronization and specific application areas such as media and gaming.|
|Hyper-Threading Technology enhancements||Hyper-Threading enhancements help increase server application performance.|
|PCI Express* I/O capability with 3X8 and 1X4 lanes||PCI Express* offers greater performance headroom and bandwidth efficiency than previous generations.|
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|Intel® E8500 TNB .13um Technology (MP Server Northbridge)||1432-pin Flip Chip-Ball Grid Array (FC-BGA3) Package|
|Intel® E8500 XMB .13um Technology (ECC MP Server)||829-pin Flip Chip-Ball Grid Array (FC-BGA3) Package|